AMD CEO Dr Lisa Su made several exciting announcements about their desktop and datacentre products during her CES 2023 opening keynote in Las Vegas. Along with a range of laptop CPUs and GPUs, AMD unveiled the powerful Ryzen 7000 X3D series CPUs that come with integrated 3D Vcache. These CPUs are touted as the world’s most powerful for gaming, surpassing the previous Ryzen 9 7950X as AMD’s flagship offering. Additionally, AMD introduced new mainstream desktop CPUs that offer limited overclocking support and competitive price points. To top it off, AMD unveiled the Instinct MI300, the world’s first integrated datacentre chip that combines CPU and GPU cores, and the Alveo A70 plug-in accelerator card with the new XDNA AI acceleration architecture.
Expanding on the success of the previous generation’s only model with integrated 3D Vcache, the Ryzen 7 5800X3D, AMD now presents three options. The flagship Ryzen 9 7950X3D boasts 16 cores, 32 threads, and a massive 144MB of cache memory. With a 120W TDP rating and a boost speed of 5.7GHz, this CPU caters to gamers and content creators seeking top-notch performance. It delivers up to 24 percent better gaming performance compared to the previous generation.
Joining the lineup are the Ryzen 9 7900X3D with 12 cores and 140MB of cache memory, and the Ryzen 7 7800X3D with eight cores and 104MB of cache memory. The Ryzen 7000 X3D CPU family will hit the market in February 2023, with pricing details to be announced later.
In addition, AMD is introducing three new mainstream Ryzen 7000 CPUs targeting a 65W TDP level. Retail CPUs will come with a cooler in the box. The 12-core Ryzen 9 7900 will be available for $429, the 8-core Ryzen 7 7700 for $329, and the Ryzen 5 7600 priced at $229. All three CPUs will be available for purchase on January 10.
Buyers of select Ryzen 7000 CPUs will also receive a complimentary copy of Star Wars Jedi: Survivor when it becomes available.
The Instinct MI300 is an impressive integrated datacentre chip that combines CPU, GPU, and memory in a single package. It features 24 CPU cores based on the Zen 4 architecture, CDNA3 compute accelerator architecture, and 128GB of HBM3 memory. Utilizing advanced 3D stacking technology with a combination of nine 5nm and four 6nm chiplets, this chip contains over 146 billion transistors, making it AMD’s most advanced design yet. The company claims it offers 8X performance and 5X efficiency gains over the previous-generation Instinct MI250X HPC accelerator, enabling faster processing of larger AI models at a reduced cost and power consumption. It will soon be available for sampling to HPC and AI customers and will hit the market in the second half of 2023.
The AMD Alveo A70 is a low-profile add-in card that utilizes the new XDNA AI architecture, which AMD states can be scaled across products to address various segments. The Alveo A70 is optimized for AI inference and power efficiency, outperforming Nvidia’s competition by up to 80 percent in AMD’s own tests. It is currently available for pre-order to AI cloud infrastructure developers.
Denial of responsibility! TechCodex is an automatic aggregator of the all world’s media. In each content, the hyperlink to the primary source is specified. All trademarks belong to their rightful owners, and all materials to their authors. For any complaint, please reach us at – [email protected]. We will take necessary action within 24 hours.
Eugen Boglaru is an AI aficionado covering the fascinating and rapidly advancing field of Artificial Intelligence. From machine learning breakthroughs to ethical considerations, Eugen provides readers with a deep dive into the world of AI, demystifying complex concepts and exploring the transformative impact of intelligent technologies.
