2024 IEEE Electronic Components and Technology Conference to Spotlight Cutting-Edge Microelectronics Packaging Technologies; Photonic Devices, Heterogeneous Integration Among Key Topics

2024 IEEE Electronic Components and Technology Conference to Spotlight Cutting-Edge Microelectronics Packaging Technologies; Photonic Devices, Heterogeneous Integration Among Key Topics

Insider Brief The 74th annual ECTC will take place May 28-31, 2024 at Denver’s Gaylord Rockies Resort & Convention Center. More than 1,500 scientists, engineers and businesspeople from more than 20 countries are expected to attend. Topics include heterogeneous integration, photonics, components, materials, assembly, reliability, modeling, interconnect design and technology, 2.5D/3D integration technologies, direct/hybrid bonding, …

Read more

Bridging Digital & Physical Worlds with Efficiency & Intelligence

Bridging Digital & Physical Worlds with Efficiency & Intelligence

For the last 44 years, the IEEE Symposium on VLSI Technology & Circuits has delivered a unique convergence of technology and circuits for the microelectronics industry, with maximum synergy between both domains. The 2024 IEEE Symposium on VLSI Technology & Circuits is organized around the theme: “Bridging the Digital & Physical Worlds with Efficiency & Intelligence.” The five-day …

Read more

Standards Matter for Cars, Plugs, WiFi—and AI?

Standards Matter for Cars, Plugs, WiFi—and AI?

Artificial intelligence holds much promise for innovation and progress, but it also has the potential to cause harm. To enable the responsible development and use of AI, the International Organization for Standardization (ISO) recently released ISO/IEC 42001, a new standard for AI management systems. According to ISO, this standard “offers organizations the comprehensive guidance they …

Read more