SK hynix Partners with TSMC on HBM – High-Performance Computing News Analysis

SK hynix Partners with TSMC on HBM – High-Performance Computing News Analysis

Seoul, April 19, 2024 – Memory company SK hynix Inc. announced today a memorandum of understanding with TSMC to produce next-generation HBM and enhance logic and HBM integration through advanced packaging technology. The company plans to proceed with the development of HBM4, or the sixth generation of the HBM family, slated to be mass produced …

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SK hynix to Invest $3.9B in Indiana HBM Fab and R&D with Purdue – High-Performance Computing News Analysis

SK hynix to Invest .9B in Indiana HBM Fab and R&D with Purdue – High-Performance Computing News Analysis

Memory chip company SK hynix announced it will invest $3.87 billion in West Lafayette, Indiana to build an advanced packaging fabrication and R&D facility for AI products. The project, which the company said is the first of its kind in the U.S., will be an advanced semiconductor production line that will produce next-generation HBM, which …

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