Qualcomm Snapdragon 855+ Awarded as Best Performer by AnTuTu, Kirin 810 and MediaTek Helio G90T as Most Cost-Effective

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AnTuTu, one of the popular benchmarking platform for gauging the performance of SoCs has revealed the ranking of the best mobile chips of the year 2019 based on metrics such as raw performance, technology innovation, and cost-effectiveness. This ranking is also called as the AnTuTu Awards 2019. 

At this award, the Qualcomm Snapdragon 855+ has been awarded as the best performing SoC, while on the other hand, Huawei’s HiSilicon Kirin 810 and MediaTek’s Helio G90T shared the award for being the most cost-effective SoCs. Apart from this, SoCs from Qualcomm, Samsung, MediaTek, and Huawei jointly shared the award for technology innovation.

Well, it should be noted that the AnTuTu Awards 2019 doesn’t include Apple’s in-house A-series SoCs, alongside new offerings such as the Qualcomm Snapdragon 865 that have yet to arrive on a commercially available device. Here is the category-wise awards given by AnTuTu in the AnTuTu Awards 2019:

Qualcomm Snapdragon 855+: Flagship Performance Award    

Qualcomm’s Snapdragon 855+, which made its way to the flagship smartphones such as the Realme X2 Pro, won the AnTuTu Awards 2019: SoC for being the best-performing SoC. The Snapdragon 855+ had an average score of 480,000, leaving behind other flagship silicon chips from Huawei, Samsung, and MediaTek.

Most Cost-Effective Award: Huawei HiSilicon Kirin 810 and MediaTek Helio G90T

Even after being available limited to only Huawei and Honor-branded devices, Huawei’s HiSilicon Kirin 810 shared the AnTuTu Awards 2019: SoC in the cost-effectiveness category with MediaTek Helio G90T SoC. The MediaTek offering is targeted at affordable gaming-centric phones and has made its way to the Redmi Note 8 Pro.

Technology Innovation Award: Huawei HiSilicon Kirin 990 5G, Qualcomm Snapdragon 765G, MediaTek Dimensity 1000L, and Samsung Exynos 980

In the Technology Innovation category, AnTuTu awarded four winners from four different chipmakers. Huawei’s flagship HiSilicon Kirin 990 5G shared the award with Samsung’s own Exynos 980, Qualcomm’s Snapdragon 765G, and MediaTek’s first 5G SoC – Dimensity 1000L – which recently made its way to the Oppo Reno 3.

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