U.S. memory chip maker Micron Technology announced today a new package called uMCP5. The latter is the industry’s first UFS multi-chip package featuring low-power LPDDR5 RAM. The chip is a “combination of high-performance, high-density, low-power memory and storage in one compact package.” The use of LPDDR5 RAM means that features found on flagship handsets can be used on high-end phones. According to Micron, these features include “image recognition, advanced artificial intelligence (AI), multicamera support, augmented reality (AR) and high-resolution displays.” The new chip is now available for mass production.
Capacity configurations are available up to 12GB of LPDDR5 memory and 512 GB NAND. The specific options include 128GB storage + 8GB LPDDR5 RAM, 128GB storage + 12GB LPDDR5 RAM, 256GB storage + 8GB LPDDR5 RAM, and 256GB storage + 12GB LPDDR5 RAM.
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