MediaTek and KaiOS Collaborates to build the next-generation Smartphones


MediaTek and KaiOS announced a collaboration to integrate MediaTek processors with KaiOS operating system to build the next-generation smartphones with 3G and 4G connectivity. Their aim is to build a phone loaded with next-generation features in it.

After this collaboration, the upcoming KaiOS operating system will run on the newly announced MediaTek 3G platforms including MT6731 and MT 6572. The first range of 3G/4G smartphones loaded with KaiOS and MediaTek process will be coming in the Q2 2019. However, at first, only 3G smartphones will be launched but thereafter, phones with dual-4G support will be launched.

MediaTek MT6731 mobile platform is expected to come with 64-bit quad-core processing which will be coupled with Dual-4G connectivity to enrich the smartphones with smart features. Also, this processor will be first to enter in this segment in the mobile market.

Speaking at the occasion TL Lee, General manager of MediaTek’s Wireless Communication business unit said, “With KaiOS’ support for MediaTek entry-segment 3G/4G chipsets, we can deliver more affordable and reliable devices, longer battery life and improve the overall user experience when compared with the old-school 2G/3G feature phones. KaiOS is putting digital services in the hands of populations that need them the most which align with MediaTek’s mission to make great technology accessible to everyone

In his reply, Sebastien Codeville, KaiOS Technologies CEO also said, “Because of our work with MediaTek, we’ll be able to connect more people in important markets where MediaTek has a strong presence, such as India, Southeastern Asia, and Africa. Through collaborative efforts like this, we can finally offer a broad range of affordable devices capable of supporting advanced applications and functionality in these markets”.

So overall, both these tech giants will be launching its first batch of phones with smart features running on KaiOS and powered by MediaTek platforms in Q2 2019.

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